Our Team

John Smith

Senior Process Engineer

With over 15 years of experience in semiconductor processing, John specializes in thin film deposition and characterization. He leads our AlScN development program and has published extensively on piezoelectric materials.

Sarah Johnson

Lead Research Scientist

Sarah brings expertise in materials science and advanced characterization techniques. Her research focuses on optimizing deposition parameters for enhanced piezoelectric performance in AlScN films.

Michael Chen

Process Integration Engineer

Michael specializes in process integration and optimization. His background in MEMS fabrication helps clients transition from prototype to production, ensuring consistent quality and high yield.

Our Services

AlN & AlScN Services

Access to advanced deposition facilities featuring the CLUSTERLINE® 200 system with comprehensive characterization capabilities.

• Co-Sputtering Chamber: In-Situ deposition of Ti, Pt, Al, Cr, AlN, and AlScN with composition control

• Single Target Chamber: High-throughput, high-uniformity AlN and AlScN deposition

• Sample Compatibility: Can accommodate samples from small chips up to 8" wafers

• Film Characterization: XRD for texture and crystallinity analysis, stress measurements, SEM/AFM for cross-sectional and surface analysis, thickness measurements, and particle counting

R&D Prototyping

Lithography

Heidelberg DWL 66+
2 µm minimum feature size
Full wafer capability

Deposition

CLUSTERLINE® 200
Sputtering systems
Up to 8" wafers

Etching

Deep Oxide Etcher
High aspect ratio features
Process optimization

Characterization

XRD & Stress Analysis
SEM & AFM
Thickness & Particles

Production Transfer

Process Documentation

Detailed process flows
Parameter optimization
Quality control metrics
Yield analysis

Foundry Selection

Capability matching
Equipment compatibility
Process validation
Cost optimization

Production Support

Technology transfer
Process integration
Yield improvement
Ongoing consultation